Invention Grant
- Patent Title: Solid-state image pickup apparatus, electronic apparatus, and method of manufacturing a solid-state image pickup apparatus
- Patent Title (中): 固态图像拾取装置，电子装置和制造固态图像拾取装置的方法
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Application No.: US13948540Application Date: 2013-07-23
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Publication No.: US08704156B2Publication Date: 2014-04-22
- Inventor: Koji Kikuchi
- Applicant: Sony Corporation
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: JPP2009-017469 20090129
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/14 ; H01L27/146 ; H01L31/0232 ; H01L31/18
Abstract:
Disclosed is a solid-state image pickup apparatus including a photoelectric converter formed on a substrate, a wiring portion formed above the photoelectric converter and constituted of multilayer wirings, and an insulating portion in which the multilayer wirings of the wiring portion are embedded, the insulating portion having a refractive index larger than a silicon oxide.
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