Invention Grant
- Patent Title: Light emitting diode and fabrication method thereof
- Patent Title (中): 发光二极管及其制造方法
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Application No.: US13059399Application Date: 2010-12-30
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Publication No.: US08704227B2Publication Date: 2014-04-22
- Inventor: Deyuan Xiao , Richard Rugin Chang , Mengjan Cherng , Chijen Hsu
- Applicant: Deyuan Xiao , Richard Rugin Chang , Mengjan Cherng , Chijen Hsu
- Applicant Address: CN Shanghai
- Assignee: Enraytek Optoelectronics Co., Ltd.
- Current Assignee: Enraytek Optoelectronics Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Blakely Sokoloff Taylor & Zafman
- Priority: CN201010508108 20101015
- International Application: PCT/CN2010/080489 WO 20101230
- International Announcement: WO2012/048506 WO 20120419
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
The present invention discloses an LED and its fabrication method. The LED comprises: a sapphire substrate; an epitaxial layer, an active layer and a capping layer arranged on the sapphire substrate in sequence; wherein a plurality of cone-shaped structures are formed on the surface of the sapphire substrate close to the epitaxial layer. The cone-shaped structures can increase the light reflected by the sapphire substrate, raising the external quantum efficiency of the LED, thus increasing the light utilization rate of the LED. Furthermore, the formation of a plurality of cone-shaped structures can improve the lattice matching between the sapphire substrate and other films, reducing the crystal defects in the film formed on the sapphire substrate, increasing the internal quantum efficiency of the LED.
Public/Granted literature
- US20130193406A1 LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF Public/Granted day:2013-08-01
Information query
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