A light emitting diode (LED) package structure including a leadframe, a housing, a LED chip and a light-transmissive encapsulant is provided. The leadframe has a first electrode and a second electrode separated from each other. The housing wraps the first electrode and the second electrode and includes a recess having a bottom and a sidewall. The bottom of the recess has a cover layer covering the leadframe and having an opening exposing an end of the first electrode, an end of the second electrode and a spacer disposed therebetween and connected thereto wherein the spacer, the end of the first electrode and the end of the second electrode are substantially coplanar. The LED chip is disposed in the recess and electrically connected to leadframe. The light-transmissive encapsulant is filled in the recess.