Invention Grant
- Patent Title: Semiconductor memory device and method of fabricating the same
- Patent Title (中): 半导体存储器件及其制造方法
-
Application No.: US13759746Application Date: 2013-02-05
-
Publication No.: US08704287B2Publication Date: 2014-04-22
- Inventor: Hideaki Maekawa
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-120067 20070427
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
A semiconductor memory includes a memory cell array area provided with first and second memory cells and having a first active area and a first element isolation area constituting a line & space structure, and having a floating gate electrode and a control gate electrode in the first active area, a word line contact area adjacent to the memory cell array area and having a second active area, first and second word lines with a metal silicide structure, functioning respectively as the control gate electrodes of the first and second memory cells and arranged to straddle the memory cell array area and the word line contact area. A dummy gate electrode is arranged just below the first and second word lines in the second active area.
Public/Granted literature
- US20130147006A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2013-06-13
Information query
IPC分类: