Invention Grant
- Patent Title: High voltage devices and methods of forming the high voltage devices
- Patent Title (中): 高电压装置及形成高压装置的方法
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Application No.: US12652294Application Date: 2010-01-05
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Publication No.: US08704312B2Publication Date: 2014-04-22
- Inventor: Chih-Chang Cheng , Ruey-Hsin Liu , Chih-Wen Yao , Chia-Chin Shen , Eric Huang , Fu Chin Yang , Chun Lin Tsai , Hsiao-Chin Tuan
- Applicant: Chih-Chang Cheng , Ruey-Hsin Liu , Chih-Wen Yao , Chia-Chin Shen , Eric Huang , Fu Chin Yang , Chun Lin Tsai , Hsiao-Chin Tuan
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
A high voltage (HV) device includes a well region of a first dopant type disposed in a substrate. A first well region of a second dopant type is disposed in the well region of the first dopant type. An isolation structure is at least partially disposed in the well region of the first dopant type. A first gate electrode is disposed over the isolation structure and the first well region of the second dopant type. A second well region of the second dopant type is disposed in the well region of the first dopant type. The second well region of the second dopant type is spaced from the first well region of the second dopant type. A second gate electrode is disposed between and over the first well region of the second dopant type and the second well region of the second dopant type.
Public/Granted literature
- US20110163376A1 HIGH VOLTAGE DEVICES AND METHODS OF FORMING THE HIGH VOLTAGE DEVICES Public/Granted day:2011-07-07
Information query
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