Invention Grant
- Patent Title: Fuse chambers on a substrate
- Patent Title (中): 在基板上的保险丝室
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Application No.: US12742300Application Date: 2007-12-19
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Publication No.: US08704333B2Publication Date: 2014-04-22
- Inventor: Andrew Phillips , Jeremy H. Donaldson , Julie J. Cox , Mark H. MacKenzie , Christopher A. Leonard
- Applicant: Andrew Phillips , Jeremy H. Donaldson , Julie J. Cox , Mark H. MacKenzie , Christopher A. Leonard
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2007/088179 WO 20071219
- International Announcement: WO2009/078879 WO 20090625
- Main IPC: H01L29/72
- IPC: H01L29/72
Abstract:
Embodiments of a system with first means for forming a chamber adjacent to a component formed on a substrate and a single orifice between the chamber and a first surface of the first means that is opposite a second surface of the first means adjacent to the substrate and second means for enclosing the chamber on at least a portion of the first surface that encompasses the single orifice are disclosed.
Public/Granted literature
- US20100283120A1 FUSE CHAMBERS ON A SUBSTRATE Public/Granted day:2010-11-11
Information query
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