Invention Grant
- Patent Title: Stacked single crystal compound semiconductor substrates
- Patent Title (中): 堆叠的单晶化合物半导体衬底
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Application No.: US13849742Application Date: 2013-03-25
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Publication No.: US08704340B2Publication Date: 2014-04-22
- Inventor: Hiroaki Fujibayashi , Masami Naito , Nobuyuki Ooya
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2011-7056 20110117
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L31/036 ; H01L29/20 ; H01L31/0304 ; H01L23/58

Abstract:
A compound semiconductor substrate includes a first substrate and a second substrate made of single crystal gallium nitride. In each of the first substrate and the second substrate, one surface is a (0001) Ga-face and an opposite surface is a (000-1) N-face. The first substrate and the second substrate are bonded to each other in a state where the (000-1) N-face of the first substrate and the (000-1) N-face of the second substrate face each other, and the (0001) Ga-face of the first substrate and the (0001) Ga-face of the second substrate are exposed.
Public/Granted literature
- US20130306977A1 COMPOUND SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2013-11-21
Information query
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