Invention Grant
- Patent Title: Packaged semiconductor chips
- Patent Title (中): 封装半导体芯片
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Application No.: US12857054Application Date: 2010-08-16
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Publication No.: US08704347B2Publication Date: 2014-04-22
- Inventor: Andrey Grinman , David Ovrutsky , Charles Rosenstein , Belgacem Haba , Vage Oganesian
- Applicant: Andrey Grinman , David Ovrutsky , Charles Rosenstein , Belgacem Haba , Vage Oganesian
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A chip-sized wafer level packaged device including a portion of a semiconductor wafer including a device, a packaging layer formed over the portion of the semiconductor wafer, the packaging layer including a material having thermal expansion characteristics similar to those of the semiconductor wafer and a ball grid array formed over a surface of the packaging layer and being electrically connected to the device.
Public/Granted literature
- US20110012259A1 PACKAGED SEMICONDUCTOR CHIPS Public/Granted day:2011-01-20
Information query
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