Invention Grant
- Patent Title: Semiconductor device having a liquid cooling module
- Patent Title (中): 具有液体冷却模块的半导体装置
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Application No.: US12683085Application Date: 2010-01-06
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Publication No.: US08704352B2Publication Date: 2014-04-22
- Inventor: Nae Hisano , Shigeo Ohashi , Yasuo Osone , Yasuhiro Naka , Hiroyuki Tenmei , Kunihiko Nishi , Hiroaki Ikeda , Masakazu Ishino , Hideharu Miyake , Shiro Uchiyama
- Applicant: Nae Hisano , Shigeo Ohashi , Yasuo Osone , Yasuhiro Naka , Hiroyuki Tenmei , Kunihiko Nishi , Hiroaki Ikeda , Masakazu Ishino , Hideharu Miyake , Shiro Uchiyama
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-002106 20090108
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/34
Abstract:
A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.
Public/Granted literature
- US20100171213A1 SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE Public/Granted day:2010-07-08
Information query
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