Invention Grant
- Patent Title: Resin-diamagnetic material composite structure
- Patent Title (中): 树脂 - 抗磁材料复合结构
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Application No.: US13591294Application Date: 2012-08-22
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Publication No.: US08704362B2Publication Date: 2014-04-22
- Inventor: Masanori Minamio , Daisuke Ujihara , Hiroshi Wada
- Applicant: Masanori Minamio , Daisuke Ujihara , Hiroshi Wada
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPP2011-182452 20110824; JPP2012-161701 20120720
- Main IPC: B32B9/04
- IPC: B32B9/04 ; H01L23/34 ; B32B15/08 ; B32B5/16 ; B32B7/02 ; B32B5/02 ; H01L21/56 ; B29C67/24

Abstract:
A composite structure 10 of a resin-diamagnetic material, including a diamagnetic material layer 12 and a resin layer 14 is obtained by a method including disposing particles of a diamagnetic material 22 and a resin 24 in a mold 30, applying a magnetic field to the diamagnetic material 22 disposed in the mold 30, and moving the diamagnetic material 22 in a direction away from at least a part of an inner surface of the mold 30, and then curing the resin 24 in the mold 30 thereby to produce a resin-diamagnetic material composite structure.
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