Invention Grant
- Patent Title: Widening resonator bandwidth using mechanical loading
- Patent Title (中): 使用机械负载扩大谐振器带宽
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Application No.: US13090790Application Date: 2011-04-20
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Publication No.: US08704428B2Publication Date: 2014-04-22
- Inventor: Changhan Hobie Yun , Chengjie Zuo , Chi Shun Lo , Sanghoon Joo , Jonghae Kim
- Applicant: Changhan Hobie Yun , Chengjie Zuo , Chi Shun Lo , Sanghoon Joo , Jonghae Kim
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H03H9/17
- IPC: H03H9/17
Abstract:
This disclosure provides systems, apparatus and techniques by which electromechanical resonators are implemented. In one aspect, by mechanically loading the resonator body in specific ways, multiple resonance modes are created within the resonator body resulting in wider bandwidths.
Public/Granted literature
- US20120268440A1 WIDENING RESONATOR BANDWIDTH USING MECHANICAL LOADING Public/Granted day:2012-10-25
Information query
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