Invention Grant
- Patent Title: Test head moving apparatus and electronic component testing apparatus
- Patent Title (中): 测试头移动装置和电子部件测试装置
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Application No.: US13003953Application Date: 2008-07-14
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Publication No.: US08704543B2Publication Date: 2014-04-22
- Inventor: Takayuki Yano
- Applicant: Takayuki Yano
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- International Application: PCT/JP2008/062670 WO 20080714
- International Announcement: WO2010/007652 WO 20100121
- Main IPC: G01R31/00
- IPC: G01R31/00
Abstract:
A test head moving apparatus includes elevating arms that move a test head up and down, a frame that horizontally moves the test head, and an interlock mechanism that prohibits the horizontal movement of the frame on the basis of a height of the test head. The interlock mechanism has a limit switch that detects that the test head is positioned at the lowermost limit and stoppers capable of pressing the pressing units onto a floor plane.
Public/Granted literature
- US20110156733A1 TEST HEAD MOVING APPARATUS AND ELECTRONIC COMPONENT TESTING APPARATUS Public/Granted day:2011-06-30
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