Invention Grant
- Patent Title: Coil-type electronic component and its manufacturing method
- Patent Title (中): 线圈型电子元件及其制造方法
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Application No.: US13348926Application Date: 2012-01-12
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Publication No.: US08704629B2Publication Date: 2014-04-22
- Inventor: Hideki Ogawa , Atsushi Tanada , Hitoshi Matsuura , Kiyoshi Tanaka , Hiroshi Kishi , Kenji Kawano
- Applicant: Hideki Ogawa , Atsushi Tanada , Hitoshi Matsuura , Kiyoshi Tanaka , Hiroshi Kishi , Kenji Kawano
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2010-105552 20100430; JP2011-091879 20110418
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H01F27/02 ; H01F5/00 ; H01F17/04 ; H01F7/06

Abstract:
A coil-type electronic component has a coil inside or on the surface of its base material and is characterized in that: the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer.
Public/Granted literature
- US20120119871A1 COIL-TYPE ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD Public/Granted day:2012-05-17
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