Invention Grant
US08705027B2 Optical defect amplification for improved sensitivity on patterned layers 有权
光学缺陷放大,提高图案层的灵敏度

Optical defect amplification for improved sensitivity on patterned layers
Abstract:
A method for wafer defect inspection may include, but is not limited to: providing an inspection target; applying at least one defect inspection enhancement to the inspection target; illuminating the inspection target including the at least one inspection enhancement to generate one or more inspection signals associated with one or more features of the inspection target; detecting the inspection signals; and generating one or more inspection parameters from the inspection signals. An inspection target may include, but is not limited to: at least one inspection layer; and at least one inspection enhancement layer.
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