Invention Grant
- Patent Title: Loop heat pipe and electronic apparatus
- Patent Title (中): 回路热管和电子设备
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Application No.: US13527920Application Date: 2012-06-20
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Publication No.: US08705236B2Publication Date: 2014-04-22
- Inventor: Hiroki Uchida , Susumu Ogata , Seiji Hibino , Jun Taniguchi
- Applicant: Hiroki Uchida , Susumu Ogata , Seiji Hibino , Jun Taniguchi
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2011-214168 20110929
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/00

Abstract:
A loop heat pipe includes: an evaporator to convert liquid phase working fluid into vapor phase working fluid; a condenser to convert vapor phase working fluid into liquid phase working fluid; a first vapor line and a first liquid line to allow the evaporator to communicate with the condenser and form a circular main loop; and a second vapor line and a second liquid line to allow the evaporator to communicate with the condenser and form a circular auxiliary loop; wherein the evaporator includes a reservoir that temporarily stores the liquid phase working fluid, a first vapor collector that communicates with the first vapor line, a second vapor collector that communicates with the second vapor line, first wick disposed between the reservoir and the first vapor collector, and second wick disposed between the reservoir and the second vapor collector.
Public/Granted literature
- US20130083482A1 LOOP HEAT PIPE AND ELECTRONIC APPARATUS Public/Granted day:2013-04-04
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