Invention Grant
- Patent Title: Circuit board and mother laminated body
- Patent Title (中): 电路板和母体层叠体
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Application No.: US13232135Application Date: 2011-09-14
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Publication No.: US08705247B2Publication Date: 2014-04-22
- Inventor: Noboru Kato
- Applicant: Noboru Kato
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-068134 20090319
- Main IPC: H05K1/18
- IPC: H05K1/18

Abstract:
A circuit board includes a laminated body including insulation layers made of a flexible material that are stacked on one another. External electrodes are provided on a bottom surface of the laminated body. Ground conductors are provided in the laminated body and that are harder than the insulation layers. The laminated body includes a flexible region and a rigid region that is adjacent to the flexible region when viewed in plan from a z-axis direction. The rigid region is defined by the ground conductors when viewed in plan from the z-axis direction. The external electrodes are provided within the flexible region when viewed in plan from the z-axis direction.
Public/Granted literature
- US20120002380A1 CIRCUIT BOARD AND MOTHER LAMINATED BODY Public/Granted day:2012-01-05
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