Invention Grant
- Patent Title: Dual swirler
- Patent Title (中): 双旋流器
-
Application No.: US12622685Application Date: 2009-11-20
-
Publication No.: US08707703B2Publication Date: 2014-04-29
- Inventor: Ik Soo Kim
- Applicant: Ik Soo Kim
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Priority: EP08020578 20081126
- Main IPC: F02C7/057
- IPC: F02C7/057

Abstract:
A swirler arrangement for injecting a fluid into a tubular swirling chamber is provided. The swirler arrangement includes a first radial swirler device and a second radial swirler device. The swirler arrangement is fixed around an internal circulation zone of the tubular swirling chamber. The first radial swirler device includes first vanes, wherein the first vanes are formed to inject the fluid into the internal circulation zone with a first injecting angle. The second radial swirler device includes second vanes, wherein the second vanes are formed to inject the fluid into the internal circulation zone with a second injecting angle. The first injecting angle and the second injecting angle are defined by an angle between an injecting direction of the fluid and the tangential direction along the inner surface. A method of injecting a fluid into a tubular swirling chamber by the swirler arrangement is also provided.
Public/Granted literature
- US20100126176A1 Dual swirler Public/Granted day:2010-05-27
Information query
IPC分类: