Invention Grant
- Patent Title: Device substrate attachment structure
- Patent Title (中): 设备基板连接结构
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Application No.: US13429708Application Date: 2012-03-26
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Publication No.: US08708293B2Publication Date: 2014-04-29
- Inventor: Akira Yokawa
- Applicant: Akira Yokawa
- Applicant Address: JP Osaka
- Assignee: Funai Electric Co., Ltd.
- Current Assignee: Funai Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Keating & Bennett, LLP
- Priority: JP2011-085765 20110407
- Main IPC: A47B96/06
- IPC: A47B96/06

Abstract:
In a device substrate attachment structure, when a substrate including a terminal holder attached to an end portion thereof is attached to a frame made of sheet metal, the substrate is attached to the frame via the terminal holder without using a screw fastening structure. The terminal holder is attached to the frame via an engagement/disengagement mechanism. The engagement/disengagement mechanism includes through-hole portions on a side of the frame, a seat portion, claw portions, and leg portions on the side of the terminal holder, and a positioning mechanism on the side of a cabinet. The positioning mechanism includes rim portions of an opening window of the cabinet.
Public/Granted literature
- US20120256066A1 DEVICE SUBSTRATE ATTACHMENT STRUCTURE Public/Granted day:2012-10-11
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