The present application is directed to a system for verifying calibration of a temperature sensor comprising an above-ambient temperature verifier and a below-ambient temperature verifier. The above-ambient temperature verifier includes a first housing containing an ohmic material. At least one pair of electrodes is provided to direct an applied current through the ohmic material to heat the material. A well is provided within the ohmic material for accepting a temperature sensor. A compression assembly cooperates with the ohmic material to create intimate contact with the temperature sensor. An above-ambient reference temperature monitor maintains a calibrated temperature within the ohmic material. The below-ambient temperature verifier includes a second housing and a below-ambient reference temperature monitor to maintain a calibrated temperature of a below-ambient temperature medium. The system further includes the ability to log all temperature test measurements from an RFID tag located on each temperature sensor to be verified.