Invention Grant
- Patent Title: Substrate treating apparatus with inter-unit buffers
- Patent Title (中): 具有单位间缓冲液的基板处理装置
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Application No.: US14011993Application Date: 2013-08-28
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Publication No.: US08708587B2Publication Date: 2014-04-29
- Inventor: Hiroyuki Ogura , Kenya Morinishi , Tsuyoshi Mitsuhashi , Yasuo Kawamatsu , Yoshiteru Fukutomi , Hiromichi Nagashima
- Applicant: Sokudo, Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Sokudo Co., Ltd.
- Current Assignee: Sokudo Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2007-310676 20071130
- Main IPC: G03D5/00
- IPC: G03D5/00

Abstract:
The invention provides coating units, heat-treating units, and a first main transport mechanism for transporting substrates to each of these treating units. The substrates are transferred from the first main transport mechanism to a second main transport mechanism through a receiver. When a substrate cannot be placed on the receiver, this substrate is placed on a buffer. Thus, the first main transport mechanism can continue transporting other substrates. The other substrates in the treating units are transported between the treating units without delay, to receive a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming film on the substrates.
Public/Granted literature
- US20140000514A1 SUBSTRATE TREATING APPARATUS WITH INTER-UNIT BUFFERS Public/Granted day:2014-01-02
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