Invention Grant
- Patent Title: Active cooling substrate support
- Patent Title (中): 主动冷却基板支撑
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Application No.: US11206245Application Date: 2005-08-16
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Publication No.: US08709162B2Publication Date: 2014-04-29
- Inventor: Samuel Leung , Su Ho Cho , William Allan Bagley
- Applicant: Samuel Leung , Su Ho Cho , William Allan Bagley
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: C23C16/458
- IPC: C23C16/458 ; C23C16/46 ; H01L21/306 ; H01L21/3065 ; H01J37/32 ; H01L21/67
Abstract:
A substrate support assembly and method for controlling the temperature of a substrate within a process chamber with a temperature uniformity of +/−5° C. are provided. A substrate support assembly includes a thermally conductive body comprising an aluminum material, a substrate support surface on the surface of the thermally conductive body and adapted to support the large area glass substrate thereon, one or more heating elements embedded within the thermally conductive body, and one or more cooling channels embedded within the thermally conductive body and positioned around the one or more heating elements. A process chamber comprising the substrate support assembly of the invention is also provided.
Public/Granted literature
- US20070039942A1 Active cooling substrate support Public/Granted day:2007-02-22
Information query
IPC分类:
