Invention Grant
- Patent Title: Upper electrode backing member with particle reducing features
- Patent Title (中): 具有减少粒子特性的上部电极背衬部件
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Application No.: US12967750Application Date: 2010-12-14
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Publication No.: US08709202B2Publication Date: 2014-04-29
- Inventor: Anthony De La Llera , Allan K. Ronne , Jaehyun Kim , Jason Augustino , Rajinder Dhindsa , Yen-Kun Wang , Saurabh J. Ullal , Anthony J. Norell , Keith Comendant , William M. Denty, Jr.
- Applicant: Anthony De La Llera , Allan K. Ronne , Jaehyun Kim , Jason Augustino , Rajinder Dhindsa , Yen-Kun Wang , Saurabh J. Ullal , Anthony J. Norell , Keith Comendant , William M. Denty, Jr.
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Buchanan Ingersoll & Rooney PC
- Main IPC: H01L21/306
- IPC: H01L21/306 ; C23C16/00

Abstract:
Components of a plasma processing apparatus includes a backing member with gas passages attached to an upper electrode with gas passages. To compensate for the differences in coefficient of thermal expansion between the metallic backing member and upper electrode, the gas passages are positioned and sized such that they are misaligned at ambient temperature and substantially concentric at an elevated processing temperature. Non-uniform shear stresses can be generated in the elastomeric bonding material, due to the thermal expansion. Shear stresses can either be accommodated by applying an elastomeric bonding material of varying thickness or using a backing member comprising of multiple pieces.
Public/Granted literature
- US20110086513A1 UPPER ELECTRODE BACKING MEMBER WITH PARTICLE REDUCING FEATURES Public/Granted day:2011-04-14
Information query
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