Invention Grant
- Patent Title: High-density fiber optic modules and module housings and related equipment
- Patent Title (中): 高密度光纤模块和模块外壳及相关设备
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Application No.: US12771473Application Date: 2010-04-30
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Publication No.: US08712206B2Publication Date: 2014-04-29
- Inventor: Terry L. Cooke , Gerald J. Davis , David L. Dean, Jr. , Marco A. Gonzalez Garcia , Tory A. Klavuhn , Manuel A. Lopez Sanchez , Brian K. Rhoney , Alan W. Ugolini
- Applicant: Terry L. Cooke , Gerald J. Davis , David L. Dean, Jr. , Marco A. Gonzalez Garcia , Tory A. Klavuhn , Manuel A. Lopez Sanchez , Brian K. Rhoney , Alan W. Ugolini
- Applicant Address: US NC Hickory
- Assignee: Corning Cable Systems LLC
- Current Assignee: Corning Cable Systems LLC
- Current Assignee Address: US NC Hickory
- Main IPC: G02B6/00
- IPC: G02B6/00

Abstract:
High-density fiber optic modules and fiber optic module housings and related equipment are disclosed. In certain embodiments, a front opening of a fiber optic module and/or fiber optic module housing is configured to receive fiber optic components. The width and/or height of the front opening can be provided according to a designed relationship to a width and/or height, respectively, of a front side of a main body of the fiber optic module and/or fiber optic module housing. In this manner, a high density of fiber optic components and/or connections for a given space of the front side of the fiber optic module can be supported by the fiber optic module and/or fiber optic module housing. The fiber optic modules and fiber optic module housings disclosed herein can be disposed in fiber optic equipment including but not limited to a fiber optic chassis and a fiber optic equipment drawer.
Public/Granted literature
- US20100322579A1 HIGH-DENSITY FIBER OPTIC MODULES AND MODULE HOUSINGS AND RELATED EQUIPMENT Public/Granted day:2010-12-23
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