Invention Grant
- Patent Title: Release layer
- Patent Title (中): 释放层
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Application No.: US13259115Application Date: 2009-08-17
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Publication No.: US08712298B2Publication Date: 2014-04-29
- Inventor: Raia Slivniak-Zozin , Nava Klein , Fernanda Orlik , Naseem Yacoub , Oshra Raviv , Meir Soria
- Applicant: Raia Slivniak-Zozin , Nava Klein , Fernanda Orlik , Naseem Yacoub , Oshra Raviv , Meir Soria
- Applicant Address: NL Maastricht
- Assignee: Hewlett-Packard Indigo B.V.
- Current Assignee: Hewlett-Packard Indigo B.V.
- Current Assignee Address: NL Maastricht
- International Application: PCT/IB2009/006717 WO 20090817
- International Announcement: WO2011/021061 WO 20110224
- Main IPC: G03G15/14
- IPC: G03G15/14

Abstract:
At least a portion of an intermediate transfer member includes a release layer facing outwardly from and supported by a supportive portion. The release layer includes an inner layer and an outer layer over and in contact with the inner layer, The inner layer has a thickness of between about 1 μm and about 8 μm and a bulk swelling of between 120% and 350%. The outer layer has a thickness of less than about 5 μm and a bulk swelling of less than 120%.
Public/Granted literature
- US20120134695A1 RELEASE LAYER Public/Granted day:2012-05-31
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