Invention Grant
- Patent Title: Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder
- Patent Title (中): 同时双面晶圆研磨机中的静压垫压力调制
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Application No.: US13049536Application Date: 2011-03-16
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Publication No.: US08712575B2Publication Date: 2014-04-29
- Inventor: Sumeet S. Bhagavat , Roland R. Vandamme , Tomomi Komura
- Applicant: Sumeet S. Bhagavat , Roland R. Vandamme , Tomomi Komura
- Applicant Address: US MO St. Peters
- Assignee: MEMC Electronic Materials, Inc.
- Current Assignee: MEMC Electronic Materials, Inc.
- Current Assignee Address: US MO St. Peters
- Agency: Armstrong Teasdale LLP
- Main IPC: B24B1/00
- IPC: B24B1/00 ; H01L21/00 ; B24B9/14 ; H01L21/78 ; B24B37/04
Abstract:
Systems and methods are disclosed for modulating the hydrostatic pressure in a double side wafer grinder having a pair of grinding wheels. The systems and methods use a processor to measure the amount of electrical current drawn by the grinding wheels. Pattern detection software is used to predict a grinding stage based on the measured electrical current. The hydrostatic pressure is changed by flow control valves at each stage to change the clamping pressure applied to the wafer and to thereby improve nanotopology in the processed wafer.
Public/Granted literature
- US20110237160A1 Hydrostatic Pad Pressure Modulation in a Simultaneous Double Side Wafer Grinder Public/Granted day:2011-09-29
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