Invention Grant
- Patent Title: Capacitor comprising flex crack mitigation voids
- Patent Title (中): 包含柔性裂纹缓解空隙的电容器
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Application No.: US13171564Application Date: 2011-06-29
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Publication No.: US08713770B2Publication Date: 2014-05-06
- Inventor: John D. Prymak
- Applicant: John D. Prymak
- Applicant Address: US SC Simpsonville
- Assignee: Kemet Electronics Corporation
- Current Assignee: Kemet Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Agency: Perkins Law Firm, LLC
- Agent Joseph T. Guy
- Main IPC: H01G7/00
- IPC: H01G7/00 ; H01G4/06 ; H01G4/30 ; H01G4/20
Abstract:
A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures.
Public/Granted literature
- US20110252614A1 CAPACITOR COMPRISING FLEX CRACK MITIGATION VOIDS Public/Granted day:2011-10-20
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