Invention Grant
- Patent Title: Method of manufacturing a printed wiring board
- Patent Title (中): 制造印刷电路板的方法
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Application No.: US12908404Application Date: 2010-10-20
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Publication No.: US08713792B2Publication Date: 2014-05-06
- Inventor: Taiji Sakai , Seiki Sakuyama
- Applicant: Taiji Sakai , Seiki Sakuyama
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: H01R9/00
- IPC: H01R9/00 ; H05K3/00
Abstract:
A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer. The first metal layer and the second metal layer together cause an eutectic reaction.
Public/Granted literature
- US20110031002A1 PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION Public/Granted day:2011-02-10
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