Invention Grant
- Patent Title: Refrigerating cycle apparatus
- Patent Title (中): 制冷循环装置
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Application No.: US13119277Application Date: 2009-09-30
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Publication No.: US08713962B2Publication Date: 2014-05-06
- Inventor: Takashi Okazaki
- Applicant: Takashi Okazaki
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2008-255963 20081001
- International Application: PCT/JP2009/067003 WO 20090930
- International Announcement: WO2010/038762 WO 20100408
- Main IPC: F25B1/06
- IPC: F25B1/06

Abstract:
To obtain a refrigerating cycle apparatus that reduces a pressure loss at the time of a normal operation in which an ejector is bypassed to improve refrigeration cycle performance. A second throttle apparatus is installed on piping path between the outlet of a condenser, which is a radiator, and the outlet of a first throttle device. A check valve is installed on piping path between a gas refrigerant suction section of the ejector and the outlet of the ejector.
Public/Granted literature
- US20110203309A1 REFRIGERATING CYCLE APPARATUS Public/Granted day:2011-08-25
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