Invention Grant
- Patent Title: Thermal fluid flow sensor and method of manufacturing the same
- Patent Title (中): 热流体流量传感器及其制造方法
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Application No.: US13351157Application Date: 2012-01-16
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Publication No.: US08714008B2Publication Date: 2014-05-06
- Inventor: Noriyuki Sakuma
- Applicant: Noriyuki Sakuma
- Applicant Address: JP Hitachinaka-shi, Ibaraki
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi, Ibaraki
- Agency: Miles & Stockbridge P.C.
- Priority: JP2011-066964 20110325
- Main IPC: G01F1/68
- IPC: G01F1/68

Abstract:
In a thermal sensor with a detection part and a circuit part formed on the same substrate, an insulating film for protection of the circuit part causes problems of lowering in sensitivity of a heater, deterioration in accuracy due to variation of a residual stress in the detection part, etc. A layered film including insulating films is formed on a heating resistor, an intermediate layer is formed thereon, and a layered film including insulating films is formed further thereon. The intermediate layer is specified to be a layer made up of any one of aluminum nitride, aluminum oxide, silicon carbide, titanium nitride, tungsten nitride, and titanium tungsten. This configuration enables the layered film on the upper part of the detection part to be removed using the intermediate layer as an etch stop layer, which solves problems of lowering in sensitivity, a variation in residual stress, etc. resulting from these.
Public/Granted literature
- US20120240674A1 THERMAL FLUID FLOW SENSOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-09-27
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