Invention Grant
- Patent Title: Screen printing apparatus and screen printing method
- Patent Title (中): 丝网印刷设备和丝网印刷方法
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Application No.: US13141817Application Date: 2010-04-14
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Publication No.: US08714084B2Publication Date: 2014-05-06
- Inventor: Seiko Abe , Tetsuya Tanaka
- Applicant: Seiko Abe , Tetsuya Tanaka
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLp
- Priority: JP2009-105980 20090424
- International Application: PCT/JP2010/002690 WO 20100414
- International Announcement: WO2010/122736 WO 20101028
- Main IPC: B05C17/04
- IPC: B05C17/04 ; B41F5/16

Abstract:
The present invention provides a screen printing apparatus and screen printing method which, in screen printing that is to be performed on the upper surface of a circuit board, and the bottom surfaces of recess openings in the upper surface, can efficiently perform a printing work while ensuring an excellent printing quality. In a screen printing apparatus which prints a paste for bonding an electronic component on an upper surface and a bottom-surface of a recess, a printing apparatus 2(1) and a printing apparatus 2(2) which sequentially 10 print the paste in two steps on the circuit board are placed in series. The printing apparatus 2(1) on the upstream side includes a bottom-surface printing mask which is provided in correspondence with the bottom surface of the recess, and a closed squeegee mechanism 36A which butts against and slides over an upper surface of the bottom-surface printing mask to 15 pressurize and supply the paste. The printing apparatus 2(2) on the downstream side includes an upper-surface printing mask which is provided in correspondence with the upper surface and an opened squeegee mechanism 36B which butts against and slides over an upper surface of the upper-surface printing mask to fill the paste into pattern holes.
Public/Granted literature
- US20110259217A1 SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD Public/Granted day:2011-10-27
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