Invention Grant
US08714169B2 Spin head, apparatus for treating substrate, and method for treating substrate
有权
旋转头,处理基板的设备,以及处理基板的方法
- Patent Title: Spin head, apparatus for treating substrate, and method for treating substrate
- Patent Title (中): 旋转头,处理基板的设备,以及处理基板的方法
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Application No.: US12623582Application Date: 2009-11-23
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Publication No.: US08714169B2Publication Date: 2014-05-06
- Inventor: Taek Youb Lee , Jeong Yong Bae , Choon Sik Kim
- Applicant: Taek Youb Lee , Jeong Yong Bae , Choon Sik Kim
- Applicant Address: KR Chungcheongnam-do
- Assignee: Semes Co. Ltd.
- Current Assignee: Semes Co. Ltd.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Carter, DeLuca, Farrell & Schmidt, LLP
- Priority: KR10-2008-0118164 20081126; KR10-2008-0118168 20081126; KR10-2009-0035924 20090424
- Main IPC: B08B3/00
- IPC: B08B3/00

Abstract:
Provided is a spin head supporting a substrate and rotating the substrate. The spin head includes a body, chuck pins installed on the body and moving between supporting positions where a substrate is supported and waiting positions providing space for loading/unloading of the substrate, and a chuck pin moving unit configured to move the chuck pins. The chuck pin moving unit includes a rotation rod coupled with each of the chuck pins, a pivot pin fixing the rotation rod to the body, and a driving member rotating the rotation rod about the pivot pin as a rotation shaft to move the chuck pin from the supporting position to the waiting position. When the body rotates, the rotation rod uses reverse centrifugal force to apply force to the chuck pin from the waiting position to the supporting position. The chuck pins include first pins and second pins that alternately chuck a substrate during a process.
Public/Granted literature
- US20100126539A1 SPIN HEAD, APPARATUS FOR TREATING SUBSTRATE, AND METHOD FOR TREATING SUBSTRATE Public/Granted day:2010-05-27
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