Invention Grant
- Patent Title: Fluid-filled vibration-damping device
- Patent Title (中): 流体填充减振装置
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Application No.: US13534432Application Date: 2012-06-27
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Publication No.: US08714530B2Publication Date: 2014-05-06
- Inventor: Tomohiro Kanaya
- Applicant: Tomohiro Kanaya
- Applicant Address: JP Aichi
- Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee Address: JP Aichi
- Agency: Greenblum & Bernstein P.L.C.
- Priority: JP2011-145053 20110630
- Main IPC: F16F5/00
- IPC: F16F5/00

Abstract:
A fluid-filled vibration damping device including: a partition member having first and second partition plates overlapping, and a holding area formed between overlapping surfaces of center parts of the two partition plates; and a movable membrane held and arranged in the holding area. A claw-shaped part and a perforation window are formed at respective corresponding positions of outer circumference parts of the two partition plates, and a fixing mechanism is constituted with the claw-shaped part latched in a circumference edge part of the perforation window. A widening area is provided between an outer circumference surface of the movable membrane and an inner circumference surface of the holding area by partially making a large distance therebetween. At least one of the two partition plates has a first air vent hole piercing a part constituting a wall part of the widening area.
Public/Granted literature
- US20130001842A1 FLUID-FILLED VIBRATION-DAMPING DEVICE Public/Granted day:2013-01-03
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