Handling device for handling of a wafer in the processing of the wafer with the following features: a carrier with a flat receiving side for holding the wafer, an especially lattice-like grid structure which is raised on the receiving side relative to the receiving side, a flexible cover which covers the grid structure relative to the carrier, sealing it, for fixing of the wafer on the carrier, and a grid space which is bordered by the cover and the carrier can be exposed to negative pressure, characterized in that the grid structure and the cover with the receiving side form an especially trough-shaped receiving space for holding of receiving structures which are provided on the wafer and which are raised relative to the wafer receiving side.