Invention Grant
- Patent Title: Fluid flow structure
- Patent Title (中): 流体流动结构
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Application No.: US13748696Application Date: 2013-01-24
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Publication No.: US08714718B1Publication Date: 2014-05-06
- Inventor: Judson M. Leiser , Karen St. Martin , James W. Ring
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Steven R. Ormiston
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
In one example, a fluid flow structure includes a flow path configured to simultaneously move a liquid up a slope and move a bubble down the slope. In one example, a fluid flow structure includes a horizontal conduit, a reservoir to hold a liquid above the conduit, an inlet into which liquid from the reservoir may enter the conduit, an outlet through which liquid may leave the conduit, and multiple capillary channels in the conduit extending continuously from the inlet to the outlet.
Information query
IPC分类: