Invention Grant
- Patent Title: Cutting tape and packaging bag with cutting tape
- Patent Title (中): 切割胶带和包装袋与切割胶带
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Application No.: US12741895Application Date: 2008-11-07
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Publication No.: US08714821B2Publication Date: 2014-05-06
- Inventor: Yoshinori Nanba , Kenichi Tanaka
- Applicant: Yoshinori Nanba , Kenichi Tanaka
- Applicant Address: JP Tokyo
- Assignee: Idemitsu Unitech Co., Ltd.
- Current Assignee: Idemitsu Unitech Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Millen, White, Zelano & Branigan, P.C.
- Priority: JP2007-290886 20071108
- International Application: PCT/JP2008/070297 WO 20081107
- International Announcement: WO2009/060940 WO 20090514
- Main IPC: B65D33/00
- IPC: B65D33/00 ; B65D65/26

Abstract:
A cutting tape includes a leading portion, a first base, a second base and a seal layer. The leading portion is welded on a sealant layer with the seal layer interposed therebetween. The first base and the second base, which are laminated on the leading portion, respectively include thin laminated portions and body portions to be welded on the sealant layer. The laminated portions are welded on the leading portion. The body portions respectively have a substantially trapezoidal cross section projecting toward the sealant layer and having an inclined surface adjacent to the leading portion.
Public/Granted literature
- US20100266224A1 CUTTING TAPE AND PACKAGING BAG WITH CUTTING TAPE Public/Granted day:2010-10-21
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