Invention Grant
- Patent Title: Camera module and method of manufacturing the same
- Patent Title (中): 相机模块及其制造方法
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Application No.: US12839914Application Date: 2010-07-20
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Publication No.: US08714843B2Publication Date: 2014-05-06
- Inventor: Jae Kun Woo
- Applicant: Jae Kun Woo
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2006-0022840 20060310
- Main IPC: G03B17/00
- IPC: G03B17/00
Abstract:
Camera module embodiments and methods of manufacturing camera modules are provided. A camera module can include a housing and a printed circuit board having an image sensor. The housing can be mounted to the printed circuit board using a surface mount technology. In a method of manufacturing the camera module, the image sensor and the housing can be mounted to the printed circuit board, and a lens and a filter can be coupled to an upper portion of the housing.
Public/Granted literature
- US20100278524A1 CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-11-04
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