Invention Grant
- Patent Title: System and method for unwrapping round modules
- Patent Title (中): 用于展开圆形模块的系统和方法
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Application No.: US12846045Application Date: 2010-07-29
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Publication No.: US08714902B2Publication Date: 2014-05-06
- Inventor: Malcom Lee Jones , Larren Michael Jones
- Applicant: Malcom Lee Jones , Larren Michael Jones
- Applicant Address: US TX Hereford
- Assignee: Jones Practical Innovations, LLC
- Current Assignee: Jones Practical Innovations, LLC
- Current Assignee Address: US TX Hereford
- Agent Shannon L Warren
- Main IPC: B65G65/00
- IPC: B65G65/00

Abstract:
A system and method for unwrapping round modules is disclosed. Specifically, a method for unwrapping a round module is disclosed. The method comprises supporting a round module wrapped in a module wrapper on a tilting module feeder having a tilting module feeder first side and a tilting module feeder second side, cutting the module wrapper substantially horizontally from a round module first side to a round module second side, and applying tension to a module wrapper top flap.
Public/Granted literature
- US20110197552A1 System and Method for Unwrapping Round Modules Public/Granted day:2011-08-18
Information query
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