Invention Grant
- Patent Title: Edge connector
- Patent Title (中): 边缘连接器
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Application No.: US12309094Application Date: 2007-07-10
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Publication No.: US08715009B2Publication Date: 2014-05-06
- Inventor: Leon Wu , Richard Chiu
- Applicant: Leon Wu , Richard Chiu
- Applicant Address: FR Guyancourt
- Assignee: FCI
- Current Assignee: FCI
- Current Assignee Address: FR Guyancourt
- Agency: Harrington & Smith
- Priority: TW95125101A 20060710
- International Application: PCT/EP2007/006113 WO 20070710
- International Announcement: WO2008/006550 WO 20080117
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
An edge connector for transmitting signals at a high frequency, for example in a system environment with a frequency higher than 2.0 GHz or 3.0 GHz, is provided. The connector includes a housing and at least a first and a second conductors disposed in the housing. Each conductor has a contact portion and a terminal portion, and each contact portion form a contact surface. The at least first and second conductors are disposed in the housing in such a manner that, both the contact surfaces face a first direction, the terminal portion of the first conductor is offset from the contact portion of the first conductor along the first direction, and the terminal portion of the second conductor is offset from the contact portion of the second conductor along a second direction which is opposite to the first direction.
Public/Granted literature
- US20100062649A1 EDGE CONNECTOR Public/Granted day:2010-03-11
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