Invention Grant
- Patent Title: Electronic device and audio jack thereof
- Patent Title (中): 电子设备和音频插孔
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Application No.: US13404727Application Date: 2012-02-24
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Publication No.: US08715011B2Publication Date: 2014-05-06
- Inventor: Chien-Hung Chen , Chih-Wei Tu , Yuan-Yao Tu , Wei-Syuan Lin , Pei-Hao Huang , Ping-Huang Yang
- Applicant: Chien-Hung Chen , Chih-Wei Tu , Yuan-Yao Tu , Wei-Syuan Lin , Pei-Hao Huang , Ping-Huang Yang
- Applicant Address: TW Taoyuan
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01R24/04
- IPC: H01R24/04

Abstract:
An audio jack for receiving an audio plug includes a connection hole with a position detection portion and a first audio channel contact portion therein. When the audio plug is inserted into the connection hole to the linking position, a first audio channel connection portion of the audio plug contacts the position detection portion and the first audio channel contact portion. The position detection portion and the first audio channel contact portion respectively have a first distance and a second distance to an opening of the connection hole, wherein the second distance is smaller than the first distance.
Public/Granted literature
- US20130225000A1 ELECTRONIC DEVICE AND AUDIO JACK THEREOF Public/Granted day:2013-08-29
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