Invention Grant
- Patent Title: Structure for a spring contact
- Patent Title (中): 弹簧触点结构
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Application No.: US13521233Application Date: 2011-05-11
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Publication No.: US08715015B2Publication Date: 2014-05-06
- Inventor: Dong Weon Hwang
- Applicant: Dong Weon Hwang
- Applicant Address: KR Gyeonggi-do
- Assignee: Hicon Co., Ltd.
- Current Assignee: Hicon Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Rabin & Berdo, P.C.
- International Application: PCT/KR2011/003447 WO 20110511
- International Announcement: WO2011/149203 WO 20111201
- Main IPC: H01R13/24
- IPC: H01R13/24

Abstract:
A spring contact, including: an upper contact pin having a contact portion, a head, a neck, a body and two spring holding protrusions; a lower contact pin having a construction that is the same as or similar to that of the upper contact pin and being coupled to the upper contact pin while crossing at right angles; and a spring fitted over an assembly of the upper and lower contact pins, wherein to increase the strength of the upper contact pin and increase the surface area of the contact portion, the head forms a cylindrical or square column shape or a part of the contact pin within the range from the contact portion to the spring holding protrusions has a thickness greater than the thickness of the body, thereby increasing the strength of the upper contact pin and increasing the surface area of the contact portion.
Public/Granted literature
- US20130012076A1 STRUCTURE FOR A SPRING CONTACT Public/Granted day:2013-01-10
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