Invention Grant
- Patent Title: Apparatus and method for removing a CMP pad from a platen
- Patent Title (中): 用于从压板移除CMP垫的装置和方法
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Application No.: US13347060Application Date: 2012-01-10
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Publication No.: US08715460B2Publication Date: 2014-05-06
- Inventor: John J. Bandy , Graham M. Bates , Jeffery A. Brigante
- Applicant: John J. Bandy , Graham M. Bates , Jeffery A. Brigante
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Anthony J. Canale
- Main IPC: B32B38/10
- IPC: B32B38/10

Abstract:
A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly.
Public/Granted literature
- US20130174987A1 APPARATUS AND METHOD FOR REMOVING A CMP PAD FROM A PLATEN Public/Granted day:2013-07-11
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