Invention Grant
- Patent Title: System-in-package platform for electronic-microfluidic devices
- Patent Title (中): 电子微流体装置的系统级封装平台
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Application No.: US13755293Application Date: 2013-01-31
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Publication No.: US08715592B2Publication Date: 2014-05-06
- Inventor: Ronald Dekker , Remco Henricus Wilhelmus Pijnenburg , Nicolaas Johannes Anthonius Van Veen
- Applicant: Ronald Dekker , Remco Henricus Wilhelmus Pijnenburg , Nicolaas Johannes Anthonius Van Veen
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP06111392 20060320
- Main IPC: G01N15/06
- IPC: G01N15/06

Abstract:
An integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate on a first support, an electronic circuit on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. A micro fluidic structure is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away from the first support.
Public/Granted literature
- US20130149215A1 SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES Public/Granted day:2013-06-13
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