Invention Grant
- Patent Title: Fungicidal compositions including hydrazone derivatives and copper
- Patent Title (中): 杀真菌组合物包括腙衍生物和铜
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Application No.: US13144686Application Date: 2010-01-14
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Publication No.: US08715745B2Publication Date: 2014-05-06
- Inventor: David H Young , Steven Howard Shaber , Cruz Avila-Adame , Nneka T Breaux , James M Ruiz , Thomas L Siddall , Jeffery D. Webster
- Applicant: David H Young , Cruz Avila-Adame , Nneka T Breaux , James M Ruiz , Thomas L Siddall , Jeffery D. Webster , Gerald Shaber
- Applicant Address: US IN Indianapolis
- Assignee: Dow AgroSciences, LLC.
- Current Assignee: Dow AgroSciences, LLC.
- Current Assignee Address: US IN Indianapolis
- Agency: Faegre Baker Daniels, LLP
- Agent C. W. Arnett
- International Application: PCT/US2010/021049 WO 20100114
- International Announcement: WO2010/083314 WO 20100722
- Main IPC: A01N33/26
- IPC: A01N33/26 ; A01N59/20 ; A01N33/00 ; A01N59/00 ; A01N31/00 ; A01N31/04
Abstract:
The present invention relates to the use of hydrazone compounds and copper for controlling the growth of fungi.
Public/Granted literature
- US20120009274A1 FUNGICIDAL COMPOSITIONS INCLUDING HYDRAZONE DERIVATIVES AND COPPER Public/Granted day:2012-01-12
Information query
