Invention Grant
- Patent Title: Adhesive composition for a debondable self-adhesive label
- Patent Title (中): 粘合剂组合物,用于剥离自粘标签
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Application No.: US12525438Application Date: 2008-01-31
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Publication No.: US08715797B2Publication Date: 2014-05-06
- Inventor: Stéphane André Fouquay , David Goubard
- Applicant: Stéphane André Fouquay , David Goubard
- Applicant Address: FR Paris
- Assignee: Bostik S.A.
- Current Assignee: Bostik S.A.
- Current Assignee Address: FR Paris
- Agency: Hunton & Williams LLP
- Priority: FR0700735 20070202
- International Application: PCT/FR2008/000112 WO 20080131
- International Announcement: WO2008/110685 WO 20080918
- Main IPC: B32B1/08
- IPC: B32B1/08 ; C08K5/09 ; B29B17/00 ; C08K5/04

Abstract:
Hot-melt pressure-sensitive adhesive (HMPSA) composition is disclosed comprising: a) 25 to 50% of a blend of SBS and SB styrene block copolymers; b) 45 to 75% of compatible tackifying resins having a softening temperature of between 80 to 150° C.; and c) 0.5 to 5.5% of fatty acids, the hydrocarbon chain of which comprises 10 to 22 carbon atoms. Also disclosed are a multilayer system comprising an HMPSA layer, a printable support layer and an adjacent protective layer. A self-adhesive label and process for recycling a labeled article with debonding of said label by immersing the article in a hot basic aqueous solution are also disclosed.
Public/Granted literature
- US20100092703A1 ADHESIVE COMPOSITION FOR A DEBONDABLE SELF-ADHESIVE LABEL Public/Granted day:2010-04-15
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