Invention Grant
- Patent Title: Resin composition and foam insulated wire
- Patent Title (中): 树脂组合物和泡沫绝缘电线
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Application No.: US13313711Application Date: 2011-12-07
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Publication No.: US08715798B2Publication Date: 2014-05-06
- Inventor: Hideyuki Suzuki , Yuju Endo , Sohei Kodama , Masahiro Abe , Akinari Nakayama
- Applicant: Hideyuki Suzuki , Yuju Endo , Sohei Kodama , Masahiro Abe , Akinari Nakayama
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Roberts Mlotkowski Safran & Cole P.C.
- Priority: JP2010-274007 20101208
- Main IPC: B29D22/00
- IPC: B29D22/00 ; B29D23/00 ; B32B1/08 ; B65D39/00

Abstract:
A resin composition includes a polyolefin resin. A viscosity of the resin composition is within a range of not less than 500 Pa·s and not more than 2300 Pa·s under measurement conditions of a measurement temperature of 170° C. and a measurement frequency of 1 Hz. A strain hardening rate of the resin composition in uniaxial elongational viscosity measured under measurement conditions of a measurement temperature of 150° C. and a strain rate of 3.0 s−1 is not less than 800%. A foam insulated wire includes a conductor, and a foam insulation of the resin composition extruded on an outer periphery of thereof. A diameter of the conductor is 3.5 to 18 mm, and an outer diameter of the foam insulation is not less than 8 mm.
Public/Granted literature
- US20120145433A1 RESIN COMPOSITION AND FOAM INSULATED WIRE Public/Granted day:2012-06-14
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