Invention Grant
- Patent Title: Transferring structure for flexible electronic device and method for fabricating flexible electronic device
- Patent Title (中): 柔性电子装置的传送结构和制造柔性电子装置的方法
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Application No.: US12488444Application Date: 2009-06-19
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Publication No.: US08715802B2Publication Date: 2014-05-06
- Inventor: Pao-Ming Tsai , Liang-You Jiang , Yu-Yang Chang , Hung-Yuan Li
- Applicant: Pao-Ming Tsai , Liang-You Jiang , Yu-Yang Chang , Hung-Yuan Li
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Priority: TW98104140A 20090210
- Main IPC: B32B7/00
- IPC: B32B7/00 ; B32B3/10 ; B32B7/04 ; B32B7/06 ; B32B7/12 ; B32B37/12 ; B32B38/00 ; B32B38/04 ; B32B38/10 ; B32B38/12 ; H01L21/70 ; H01L21/77
Abstract:
The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.
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