Invention Grant
US08715892B2 Mask blank, transfer mask, method of manufacturing a transfer mask, and method of manufacturing a semiconductor device
有权
掩模毛坯,转印掩模,制造转印掩模的方法以及制造半导体器件的方法
- Patent Title: Mask blank, transfer mask, method of manufacturing a transfer mask, and method of manufacturing a semiconductor device
- Patent Title (中): 掩模毛坯,转印掩模,制造转印掩模的方法以及制造半导体器件的方法
-
Application No.: US13611707Application Date: 2012-09-12
-
Publication No.: US08715892B2Publication Date: 2014-05-06
- Inventor: Noriyuki Sakaya , Osamu Nozawa
- Applicant: Noriyuki Sakaya , Osamu Nozawa
- Applicant Address: JP Tokyo
- Assignee: Hoya Corporation
- Current Assignee: Hoya Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-200195 20110914
- Main IPC: G03F1/54
- IPC: G03F1/54 ; G03F1/26

Abstract:
A mask blank is used for manufacturing a binary mask adapted to be applied with ArF excimer laser exposure light and has a light-shielding film for forming a transfer pattern on a transparent substrate. The light-shielding film has a laminated structure of a lower layer and an upper layer and has an optical density of 2.8 or more for the exposure light. The lower layer is made of a material containing tantalum and nitrogen and has a thickness of 33 nm or more. The upper layer is made of a material containing tantalum and oxygen and has a thickness of 3 nm or more. The phase difference between the exposure light transmitted through the light-shielding film and the exposure light transmitted in air for a distance equal to the thickness of the light-shielding film is 60 degrees or less.
Public/Granted literature
Information query