Invention Grant
US08715913B2 Silicon-containing resist underlayer film-forming composition and patterning process 有权
含硅抗蚀剂下层膜形成组合物和图案化工艺

Silicon-containing resist underlayer film-forming composition and patterning process
Abstract:
The present invention is a silicon-containing resist underlayer film-forming composition containing at least any one of a condensation product and a hydrolysis condensation product or both of a mixture comprising: one or more kinds of a compound (A) selected from the group consisting of an organic boron compound shown by the following general formula (1) and a condensation product thereof and one or more kinds of a silicon compound (B) shown by the following general formula (2). Thereby, there can be provided a resist underlayer film applicable not only to the resist pattern formed of a hydrophilic organic compound obtained by the negative development but also to the resist pattern formed of a hydrophobic compound obtained by the conventional positive development. R1m0B(OH)m1(OR)(3-m0-m1)  (1) R10m10R11m11R12m12Si(OR13)(4-m10-m11-m12)  (2)
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