Invention Grant
- Patent Title: Silicon-containing resist underlayer film-forming composition and patterning process
- Patent Title (中): 含硅抗蚀剂下层膜形成组合物和图案化工艺
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Application No.: US13669183Application Date: 2012-11-05
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Publication No.: US08715913B2Publication Date: 2014-05-06
- Inventor: Tsutomu Ogihara , Takafumi Ueda , Fujio Yagihashi
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2011-260525 20111129
- Main IPC: G03F7/36
- IPC: G03F7/36 ; G03F7/20 ; G03F7/30 ; G03F7/38 ; G03F7/09

Abstract:
The present invention is a silicon-containing resist underlayer film-forming composition containing at least any one of a condensation product and a hydrolysis condensation product or both of a mixture comprising: one or more kinds of a compound (A) selected from the group consisting of an organic boron compound shown by the following general formula (1) and a condensation product thereof and one or more kinds of a silicon compound (B) shown by the following general formula (2). Thereby, there can be provided a resist underlayer film applicable not only to the resist pattern formed of a hydrophilic organic compound obtained by the negative development but also to the resist pattern formed of a hydrophobic compound obtained by the conventional positive development. R1m0B(OH)m1(OR)(3-m0-m1) (1) R10m10R11m11R12m12Si(OR13)(4-m10-m11-m12) (2)
Public/Granted literature
- US20130137041A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION AND PATTERNING PROCESS Public/Granted day:2013-05-30
Information query
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