Invention Grant
- Patent Title: Thick film resists
- Patent Title (中): 厚膜抗蚀
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Application No.: US11860675Application Date: 2007-09-25
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Publication No.: US08715918B2Publication Date: 2014-05-06
- Inventor: Medhat A. Toukhy , Margareta Paunescu
- Applicant: Medhat A. Toukhy , Margareta Paunescu
- Applicant Address: US NJ Somerville
- Assignee: AZ Electronic Materials USA Corp.
- Current Assignee: AZ Electronic Materials USA Corp.
- Current Assignee Address: US NJ Somerville
- Agent Alan P. Kass; Sangya Jain
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30

Abstract:
Thick film photoresist compositions are disclosed.
Public/Granted literature
- US20090081589A1 THICK FILM RESISTS Public/Granted day:2009-03-26
Information query
IPC分类: