Invention Grant
- Patent Title: Semiconductor device manufacturing method
- Patent Title (中): 半导体器件制造方法
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Application No.: US13481803Application Date: 2012-05-26
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Publication No.: US08716080B2Publication Date: 2014-05-06
- Inventor: Mieno Fumitake
- Applicant: Mieno Fumitake
- Applicant Address: CN
- Assignee: Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN
- Agency: Innovation Counsel LLP
- Priority: CN201110354553 20111110
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L29/78

Abstract:
A semiconductor device is described as including a first fin having a layer formed of a first semiconductor material and a second fin that is formed of a second semiconductor material. The first and second semiconductor materials are different. The second semiconductor material may have a mobility of P-type carriers that is greater than a mobility of P-type carriers of the first semiconductor material. The second fin includes a layer formed of the first semiconductor material below the layer formed of the second semiconductor material. The semiconductor device further includes a hard mask layer disposed on the first and second fins and an insulator layer disposed below the first and second fins. The first and second semiconductor materials include silicon and germanium, respectively. The first and second fins are used to form respective N-channel and a P-channel semiconductor devices.
Public/Granted literature
- US20130119478A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-05-16
Information query
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